Multilayer RF PCB for Sp technological and intercon

Multilayer RF Printed Circuits Boards with embedded passives are complex structures to manufacture and to package while keeping good RF performances. In this paper, technological solutions aimed at simplifying these issues are proposed : the use of thermoset materials instead of thermoplastic laminates and an original interconnection technique based on "RF openings" machined in the edges of the boards. Two breadboards based on these solutions have been developed and demonstrate very good RF performances between 5 and 15 GHz. Fig.